Site GM, Semi Backend Operations_SEA

a Global leading semiconductor company

Candidate Profile

• 20+ years in semiconductor backend (IC packaging) and 3+ years leading large manufacturing teams (2,000+ HC or above).
• Strong expertise in wire bonding, flip-chip, molding, underfill, bumping, WLP, or final test operations.
• Proven track record in factory performance improvement, including yield, delivery, cost reduction, and automation.
• Excellent communication skills; fluent in English, with strong customer and stakeholder management ability.

Responsibilities

• Lead IC packaging factoriies (total 2,000+ employees), managing Production, Engineering, Quality, Equipment, Planning, Supply Chain, and Facility operations.
• Drive operational excellence through yield improvement, cycle-time reduction, automation, and cost optimization across all packaging lines.
• Oversee NPI and customer interface, ensuring smooth ramp-up, technical issue resolution, and alignment with global fabless/IDM customer requirements.
• Manage P&L, CapEx, and long-term capacity planning to meet corporate targets and market demand.