龍頭社群美商(可遠端)：Silicon Package Development Engineer

【Client Description】

This role presents a unique opportunity to shape the future of AR/VR devices by enabling advanced packaging technology from concept to productization.

【Candidate Profile】

• BS, MS in Materials Science, Chemical, Electrical, Mechanical Engineering or similar field
• 6+ years of experience in package development and process integration
• Knowledge of adv. packaging manufacturing processes e.g. WLCSP, SiP, FO, PoP, TSV, 3D
• Experience with successful package product qualification with complex package design
• Understanding of device reliability and experience with physical failure analysis
• Experience with DOE, data analysis & pkg design software is a plus
• Experience with display and optic related package is a plus
• Experience with TSV process, 2.5D/3D package and Hybrid bonding is a plus
• Excellent problem solving & communication skills
• Ability to work independently and take on projects with minimum supervision

【Responsibilities】

• Establish relationship with foundry, OSAT, material supplier & support package development activities for multiple research & product programs as process integration engineer.
• Support TV design, process feasibility, simulation, design rule/DFM checks with emphasis on thermo-mechanical reliability with vendor.
• Review & maintain all aspects of design integration (DI) before TO, sign-off & keep all DI documentation upto date.
• Work with XFN teams, foundries/OSAT, substrate suppliers to understand trade-offs & keep track of technology gaps, reliability risk, yield issues & provide regular updates.
• Drive DOEs for initial build and product qualification; drive triage effort with partners for any unexpected inline process, equipment & quality issues.
• Coordinate FA, monitor area/customer critical charts & drive all aspects of FA & compilation of POR, TOR, FMEA & related KPIs at the vendor.