先進封裝高階研發主管(Senior Director, Advanced Packaging R&D)

A well-known optoelectronics company

• 15+ years of professional experience
• Technical Expertise: In-depth knowledge of advanced packaging architectures and process integration, including 2.5D/3D IC, Fan-Out, and Chiplet technologies
• Language Proficiency: Fluent in both Mandarin Chinese and English
• Education: Master’s degree or above

• Advanced packaging technology R&D and process planning
• Cross-functional project integration and technology implementation
• Team leadership and R&D strategy development (managing 100+ staff)
• Business travel required: 75% or above