OSFP-XD Themral Program Lead

外商AI散熱大廠

Candidate Profile

• Direct experience with OSFP or OSFP-XD mechanical, thermal, or electrical architecture
• Understanding of 800G / 1.6T module thermal envelopes
• Familiarity with Broadcom / Nvidia / Marvell chipset thermal load profiles
• Experience with module housings, cages, and high-power transceiver constraints
• Strong understanding of MSA specifications, mechanical envelopes, and signal integrity limits
• Ability to translate customer technical needs into internal design requirements
• Industry network within optical modules, hyperscalers, or high-speed interconnects

Responsibilities

• Provide deep technical guidance on OSFP, OSFP-XD, and next-generation module standards

• Advise mechanical/thermal envelope decisions: cages, latches, housings, cold plates, module baseplate optimization

• Evaluate chipset thermal/power requirements (Broadcom, Nvidia, Marvell, etc.) and integrate into product definitions

• Support transceiver OEM requirements, customer presentation, and product positioning

• Track industry MSAs, ecosystem updates, and hyperscaler/telecom roadmaps

• Serve as the internal SME for next-gen optical interconnect architectures