Application Engineer for Semiconductor Packaging
Other service activities
Technical Services & Machinery Maintenance
About Company:
A leading provider of innovative solutions specializing in materials and technologies
Key Competencies:
- Provide hands-on technical assistance for a specialized material product line in the electronics market.
- Drive process improvements and support product commercialization through application optimization.
- Collaborate directly with client teams to troubleshoot and resolve complex product and process issues.
- Investigate and address fundamental challenges across the product portfolio by developing new application techniques and conducting material characterization.
- Conduct field testing using relevant application and analysis tools.
An Ideal Candidate:
- Bachelor’s degree in relevant technical discipline such as Materials Science, Electronic Engineering, or Chemical Engineering.
- At least 7 years of experience in semiconductor LCM, fan-out wafer-level packaging (FOWLP), or technical customer engagement.
- Strong grasp of current trends in data-center memory and advanced packaging technologies (e.g., 2.xD).
- Proven ability to analyze data effectively and translate findings into actionable insights.
- Skilled in both individual and collaborative work settings, with excellent communication abilities across diverse teams and client interactions.
- Capable of managing on-site technical support for complex customer scenarios.
- Demonstrates ownership and accountability in project execution, with a commitment to delivering high-quality outcomes aligned with client expectations.
- Fluent in Korean, with intermediate or higher proficiency in English.
Contact
Min Kim, Perm Consultant
+82.2.6200.9732
Ref: JN-012026-188070